A system and method for providing complete non-judicial dispute resolution management and operation. After a wafer test is conducted by pressing a probe against the electrode pad, wire-bonding of the electrode pad to a lead is carried out so that a probe mark formed in the electrode pad during the wafer test is completely covered by a bonding ball, which forms an end of a wire connected to the lead. Related keywords may be identified for a given search term using a combination of an aggregated life-stream analysis, a user profile based analysis, andor a community based life-stream analysis. A conductive electromagnetic-shielding member and terminal members for electrically connecting the microphone element and an external circuit are embedded in a resin body of the first member by insert molding. Window sections 34a, 34b are provided on opposing circumferential surfaces of the main body 31. The resulting 3D OPC model is then utilized for mask creation.