A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The mounting assembly has an alignment mechanism and a drive assembly. In large turbine airfoils, very fine cooling passages can be formed in the airfoil wall using the small diameter ceramic core ties used in the present invention. The first signal is associated with an input current for a power converter. The length of the message fragment is encoded, xored with an offset, enciphered to give a pad, truncated, and xored with the message fragment to give a ciphertext fragment. The wheel hub is connected to the drive element, and the wheel hub and the drive element engage positively into one another via a pair of mutually corresponding spur toothings.