A semiconductor device is disclosed. At least a portion of the selected instant messaging session is transferred from the first instant messaging controller on the first device to the second instant messaging controller on the second device and the transferred portion of 10 the instant messaging session is made perceivable on the second instant messaging controller on the second device. Solder balls are implanted to the electrical connection pads and the dummy pads. The spacer pieces of two classes are each made around outside surfaces thereof with some circular holes, which have functions of lubricant reservoirs, prevention of distortion or deformation caused in the molded spacer pieces, and ejector pinholes used to extract the molded spacer pieces out of the mold.