A method for fabricating substrate-free LED chips has a multilayer semiconductor structure at least 10 microns thick provided on a growth substrate. A support plate, which has flexible clips via which the mechanical contact between the component and the object is produced, and which produces the mechanical contact between the component and the object and therefore allows high tolerance compensation of the component during operation, is mounted between the component and the object to which it is attachable. The peripheral device which receives a DMA acknowledge signal from the controller carries out 32-bit DMA transfer using lower 16 bits of the address bus and the data bus, during assertion of the DMA acknowledge signal. At the output, the synchronized signals are again destuffed and are transmitted again at the original bit rate. 2 to about 10% above the residual sulfur in the red mud.