A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. For the at least partial structuring of the at least one structure, at least one crystal-orientation-independent etching step is additionally performed on the upper side of the silicon layer with the given surface orientation of the silicon layer. The ladder includes a platform attached to the first and second sections. The first pilot channel signal is transmitted so that it is time-division multiplexed with one or more traffic channel signals transmitted during each slot and code-division multiplexed with a second pilot channel signal transmitted during all slots of the one or more frames. A lowering device makes the movable veranda member descend vertically in an emergency state.