An apparatus and method for an enhanced thermally conductive package for high powered semiconductor devices. In a first clock phase, the method includes shifting data from a first latch element of a normal execution context to a second latch element of the normal execution context and shifting shadow data from a third latch element of a shadow execution context to a fourth latch element of the shadow execution context. The bell crank is pivotally secured to a bracket in the seat back. The connector has four quadrants, with each quadrant housing some of the contacts in an orientation.