The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The optical recognition device includes a transparent substrate, a patterned infrared reflective film formed thereon, and an infrared anti-reflective film sheltering a gap in a recognition pattern of the patterned infrared reflective film, wherein the patterned infrared reflective film reflects the recognition pattern by reflection of infrared light and transmission of visible light. A additional non-decorative veneer layer may also be bonded to the aluminum foil layer and the resulting veneer assembly may be precision belt sanded on the non-decorative side to produce a flat decorative fire resistant veneer assembly. With the slides, a device can be compatible with data transmission modules with different speeds and different interface forms.