In a manufacturing method of a semiconductor device, a substrate and a plurality of semiconductor chips stacked on the substrate are connected to each other by a ball bonding method adopting a reverse method. Moreover, the present invention also relates to a method to identify the effect of concentration polarization layer and cake layer which can vary according to the axial position of a hollow-fiber and the developing progress of a membrane fouling by measuring the position-dependent zeta potential of the hollow-fiber membrane. By request from a client, the object invocation unit obtains object code and object data from the object access unit in response to remote object invocation, executes the requested method, and requests the object access unit to overwrite the object data.