An attachment material is provided between the die and the solder balls of a TBGA or other flexible circuitry package that is sufficiently compliant to absorb pressure between the two, so as not to apply stress to the solder balls. The compositions are sufficiently acidic to perform well as fluxes, but not so acidic as to cause premature gelation or corrosion. When the ferrule and the sleeve are fitted together, the electrode terminal and the electric wiring are electrically connected and the optical fiber and the core are optically connected through the lens. One annulus is formed in a face plate and the second annulus or hole is defined by a tube extending through the face plate.