An IC that includes a memory cell and a pass gate coupled to the memory cell, where the pass gate includes a PMOS transistor, is described. In a method where a silicon wafer undergoes dicing to manufacture semiconductor devices, a groove covered by an insulating layer and spanning a dicing line is formed in the above described silicon wafer, and the silicon wafer undergoes dicing along the dicing line. The bracket provides for mounting the safety switch connected in series to the thermocouple within a water heater for detection of overheat conditions.