A semiconductor integrated circuit device, a method of manufacturing the same, and a method of driving the same are provided. A second mold has first and second nozzles therein that inject first and second resins to the first and second cavities, respectively. The implants or systems of implants and methods also make use of strong fluoroscopic landmarks. The configuration of the cyclone provides for efficient removal of fine particles as compared to conventional techniques. Instead of the second substrate, this type has a hardcoat layer formed on a surface of the first substrate opposite to another surface thereof having the recording layer thereon, the laser beam being incident to the hardcoat layer in reproduction.