The present invention relates to methods for repairing defects on a semiconductor substrate. In addition to reduced corrosion, particularly galvanic corrosion, the fastener insert is lightweight and provides improved strength to weight ratios as compared to stainless steel fastener inserts. A call directed to the phone address is routed to a call processing system. The base is wider than the top, such that each of the one or more grooves comprises a re-entrant shaped groove.