An improved semiconductor structure consists of interconnects in an upper interconnect level connected to interconnects in a lower interconnect level through use of a conductive protrusion located at the bottom of a via opening in an upper interconnect level, the conductive protrusion extends upward from bottom of the via opening and into the via opening. Programmable control sources provide separate control inputs to a buffer. The heat sink and the heat source are in a plane substantially perpendicular to the outlet air direction and to the inlet air direction alongside one another. In the case of a GMR sensor, where the easy axis is parallel to the permanent magnet set direction, these stabilizer steps are oriented parallel to the magnetization direction of the permanent magnets. The printed circuit board is electrically connected to the flexible circuit films, so as to transmit at least two different common voltages to a portion of the common electrode via the flexible circuit films. The hinge mechanism of the device includes a positive positioning system comprised of opposed interlocking ridges.