The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. A set of packet commands is provided. The one or more biometric sensing devices include a right fingerprint sensor coupled to the processor and a left fingerprint sensor coupled to the processor. Based upon the instructions of the synchronization manager, and without requesting real-time user input, a determination is made whether to copy a file on the one of the at least two portable media devices. Charging of the battery can be started when the user is assumed to have stopped using the vehicle and will not use the vehicle for a period of time. These techniques may be used to support an end-to-end electronic information distribution capability that may be used, for example, utilizing the \u201celectronic highway.