There is provided a semiconductor package that includes a metal plate, and a wiring substrate having an insulating substrate, signal wiring layer formed on one surface of the insulating substrate, and a ground plane formed integrally on other surface of the insulating substrate, whereby a surface of the ground plane side of the wiring substrate is adhered onto the metal plate. The composition can include a functionalized carbon pigment dispersed in an ink vehicle. Each of the outer and inner housing defines perforated wall sections allowing for the flow of hot gas through the wall of one housing, into contact with the particulate material, and then out through the wall of the other housing. The apparatus also includes a substrate holder that is constructed to hold a substrate, a projection system that is constructed and arranged to project the patterned beam onto a target portion of the substrate, and a downstream radical source that is connected to a gas supply and is configured to provide a beam of radicals onto a surface to be cleaned. Each leg section houses one of the pressure cylinders.