A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. At least the second clamp member is configured to be coupled to the support segment while being free to translate along the clamp path. The proximal and distal segments are connected by a set of cables in such a fashion that each proximal segment forms a discrete pair with a distal segment. The switching engines generate new activity states based on selected fault indicators. Other features include mirrors, lenses, a sample holder, and a mask for blocking out some light.