A mask used when a semiconductor wafer is diced into individual semiconductor chips by plasma etching is formed as follows. The device incorporates a pair of ceramic heater elements mounted within the tips of the tines of a forceps. At least one respective unbalanced mass is arranged on the first unbalanced shaft, on the first unbalanced shaft half, and on the second unbalanced shaft. A single shipping transaction from the seller to the buyer and the at least one local user is generated. The bent ends of the radially extended portions may be coupled to the inner circumferential of the inner tub or to the outer circumferential of the inner tub.