The present invention is directed to a high-performance system on a chip which uses multi-layer wiringinsulation through-hole interconnections to provide short wiring and controlled low-impedance wiring including ground planes and power supply distribution planes between chips. The improved compositions exhibit sufficient or improved balance of characteristics such as rolling resistance, HBU, abrasion, grip, andor tear. The micelles provided in the present invention self-assemble into nano-particles in an aqueous solution, and have good stability, biocompatibility, and biodegradability, and low cytotoxicity. A controller of the printer controls the rotation of the supply roller and the pair of feed-in rollers according to a procedure that does not rely on a position of the sheet sent by the supply roller and the pair of feed-in rollers during the continuous feeding mode. The patterned plasma-treated area formed on the chip andor on the substrate may cause greater capillary force on the underfill material, as compared to non-plasma-treated areas.