The present invention relates to circuit defect detection, classification, and review in the wafer stage of the integrated circuit semiconductor device manufacturing process. The electronic device gaming system includes a case configured to receive an electronic device. Data capturing units capture, based on the internal clock signal, data from the first signal to which the first delay is given and the second signal to which the second delay is given. The cutting insert body has a rake surface that contains at least two of the discrete depressions wherein each one of the discrete depressions corresponds to one of the cutting locations. The fillers 1 are joined together into a three-dimensional network so that the total volume of the communication holes 3 is greater than the total volume of the small holes 2. The germanium-containing layer is copper germanide, germanium oxide, germanium nitride or combinations thereof.