A semiconductor device of MCP structure, in which multiple semiconductor chips are provided in a single package and a method of manufacturing the same, that prevents damage of semiconductor chip that does not require burn-in and ensures the initial reliability of the semiconductor chip that requires the burn-in, are provided. The power supply system converts external power signals into first alternating current power signals, and converts the first AC power signals into second AC power signals. When the second job data transmitted after performing the predetermined operation by the user is stored in the storage means, acceptance of a process request for the second job data from the first user via the first display associated with the first box on the user interface is permitted. A burst disk activation is identified in response to determining that the flow is interrupted. The bus slave fulfills the request and transmits a response to the request, wherein the transmission includes the priority signal. The first level surface of the slider is at a different distance from a surface of the first rail of the slider than the second level surface of the slider.