A bag formed utilizing a hot melt adhesives comprising 20 to 70 parts ethylenealpha olefin polymer having a melt index of 50 to 500 MI, a melt point of 71 to 90 C. The integrated circuit can provide signal conditioning and analog to digital signal conversion as required. The installation section includes: a light emitting element for emitting light to an inside of the installation section; and a light receiving element for receiving the light emitted from the light emitting element. As the substrate assembly and polishing pad rub against each other, a parameter indicative of drag force between the substrate assembly and the polishing pad is measured or sensed at periodic intervals. By eliminating direct dependencies between the partitions and the partitionable keys, the system can have great flexibility with regard to migrating customer data between partitions and adding a new partition.