The present invention discloses water-soluble compositions comprising a blend of poly and poly that have improved ductility over water-soluble compositions comprising poly alone. For instance, a semiconductor substrate can be formed to have a dummy structure thereover with a surface suitable for electroless plating, and to also have a digit line thereover having about the same height as the dummy structure. The contacts are divided into an upper array and a lower array. Parallel damping achieves simple adaptation of the damping characteristics to different types of terrain.