The present disclosure is directed to a distributed control system for a locomotive. For example, an ESD diode and FinFET are fabricated on the same bulk semiconductor substrate. Additionally, there may be at least one intermediate panel having at least one or more additional boundaries, the at least one intermediate panel connectively fastened to the first panel and the second panel to create a cavity between the first panel, the second panel, and the at least one intermediate panel. Bonding wires electrically connect the individual semiconductor elements to conductive traces, while the conductive vias can provide additional electrical connections.