A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A semiconductor element is mounted on a first surface of the package substrate. In addition to the direct benefits obtained from introduction of these agents, the laser cutting properties may be varied from the selective introduction of the various agents. 70 gcm3 or less, and a saturation magnetization at a magnetic field of 796 kAm of 10 Am2kg or more and 20 Am2kg or less, and the inorganic fine particle \u201ca\u201d is a metal oxide having a volume resistivity of 1.