A semiconductor device includes: a semiconductor substrate; a semiconductor element formed on a principal surface of the semiconductor substrate and having a multiple-layered interconnect layer; and a heterostructure magnetic shield covering the semiconductor element. To achieve good noise decoupling of the contact element from the machine housing and, in use in a commutator machine, for assuring good commutation quality, the decoupling elements are embodied and disposed such that the at least one quiver is capable of executing only a limited rotational pivoting distance about the rotor. An additional fan is provided to circulate air containing sterilant from the room during a room sterilization process through that part of the enclosure which is downstream of the catalyst to ensure sterility of that part of the enclosure for the sterilant removal phase. A second sealant is present on the interior surface of each of the first and second closure profiles; this sealant enhances the seal between the closure profiles at the side edges of the bag. The nonwoven glass composites are suitable for air filtration apparatus and can be used in the semiconductor industry where the elimination of boron from clean rooms is of importance.