A manufacturing process of the combining of optical lens and senor chips includes the steps of: preparation of a wafer with a plurality of image sensor chips thereon, connection of a plurality of optical lens assemblies to the wafer, wherein each of the optical lens assemblies is associated with the image sensor chip respectively, and division of the wafer to have a plurality of image catch units. Response times approaching that of explosively actuated devices are obtained while retaining the repetitive cycling capability of non-explosively operated devices. The optical connector has a housing with at least two portions that are removably secured to one another. The element preferably has a central opening for receiving the rotor shaft. Each of the first and second AP pinned layers is composed of cobalt iron wherein the iron content in the cobalt iron of one of the first and second AP pinned layers is greater than the iron content in the cobalt iron in the other one of the first and second AP pinned layers. This results in a more efficient system that reduces the amount of emissions released.