A complex dry vacuum pump including a root rotor and a screw rotor is disclosed for manufacturing semiconductors andor displays in a vacuum state in a process chamber, and discharging gaseous material andor by-products generated during manufacturing to the exterior of the process chamber. Two pins detachably extend through the through holes in the wrench and the hole and pivot hole in the chain, so as to secure the chain to the wrench. The feedstock delivery system further includes a recycle conduit that establishes a fluid flow path for the liquid feedstock from a location downstream of the pump back to a location upstream of the pump. In the radially constricted configuration, the adjustable contacts are configured to pierce through a layer of an elongate medical device that is disposed in the hemostasis valve.