Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. Methods of the present invention make use of a sampling device having an extendable sample capture element with a concave sample capture pocket located near a distal end thereof. A thermistor detects a surface temperature of the fixing roller. For example, content can be downloaded to the data storage device when the core network-to-base station link is idle, under utilized andor has sufficient bandwidth for the download.