A package for a drug-device combination product includes an outer package including a first gas impermeable sheet and a second gas impermeable sheet hermetically sealed there to on three sides. Features such as deep trenches used in circuit elements such as trench capacitors impart stress on a wafer that is proportional to the surface area of the DTs. A first power semiconductor chip and first external contact elements is provides. A parts support anvil is placed in a required position with respect to the rivet support anvil prior to formation of the second head on the opposite end of the rivet, to provide the desired amount of clearance.