Techniques are disclosed for the dynamic introduction of new components to be used during provisioning of solutions in data processing system environments such as service delivery environments. The discharge conveying passage extends in the up-and-down direction along one side wall of the apparatus body. The method of manufacturing a semiconductor device also includes at least forming flat parts on the loop-shaped wires, and using a sealing material to seal the semiconductor chip such as to bury the flat parts. Alternatively, a pattern coincident with the projected light can be projected onto the surface and which includes a target indicating where items should be placed for scanning. An etching process is performed to etch the spacer layer so that spacers remain at sidewalls of pattern features of the mold mask pattern, and to etch the mask layer in the second region to provide mask layer patterns in the second region. The insulating layer preferably has openings above the stripe electrodes and the openings preferably have tapered side walls.