An image-pickup apparatus includes an image-pickup device having a flexible shape characteristic; and a retaining member for retaining the image-pickup device in a state being curved in the thickness direction. Both electrodes of a photodiode on a semiconductor substrate 1, which are anode and cathode, are collected on one plane of the substrate. The pumping apparatus has a pumping device and a control system for controlling operation of the pump. The system also includes a vibrator and a click generator to simulate the vibration of a motor and the sound of gear shifting, as well as a mechanism to simulate a reaction force to a steering handle. With this arrangement, both the conductive bumps and the bond wires share in the electrical interconnection between the die and the carrier substrate, thereby allowing more space for bond pads to interconnect with bond wires andor allowing for smaller die sizes.