Provided are a semiconductor package and a method of manufacturing the same. For this purpose, a mask is deposited in a three-point support of the measuring table, wherein the mask used for the calibration of the measuring table is a mask, which is used for the semiconductor production. The clip comprises a clip main body disposed outside of an outer shaft barrel, and a base portion to enter into the outer shaft barrel from the opening formed in the outer shaft barrel. A source contact pattern is defined in the second material to mask the first photosensitive material. An outer shield substantially encloses the inner shield. During operation of the computer system, the method keeps track of one or more stream lengths, wherein a stream is a sequence of memory references with a constant stride.