A system includes a wireless device and at least one transponder. The integrated circuit further includes a redistribution layer formed on the first die to couple selected bond fingers of the lead frame to selected bonding pads of the first and second die. The skew conveying member conveys the medium in a second direction crossing to the first direction so that the one end comes in contact with the alignment member and that includes a drive member and a driven member opposed to the drive member and driven by the drive member.