In a packaged integrated circuit, electrostatic discharge protection is provided by portions of a lead frame on which the integrated circuit is mounted. A method and a computer readable storage medium are also described and claimed. Parameters of a shot peening operation can be developed utilizing the test strip, and those parameters will be acceptable for use with a part having internal cavities. The method also involves a substrate, which includes a sacrificial semiconductor wafer having device areas with metalized contacts. The introduction passage and the discharge passage include an inflow port and an outflow port, respectively. One important area is the isolation and potential use of novel FKBP-ligand analogues and host cells that produce these compounds.