An apparatus for peeling in the production of three-dimensional objects is provided. The electrode is designed to allow \u201cone-point\u201d in vivo calibration, i. The pads 61 are provided on the substrate back surface 13 of the substrate main body, and have surfaces 62 on which solder bumps 84 employed for connection of a motherboard 91 can be formed. The impregnated yarns are dispensed at the second location.