Disclosed is a wafer level testing method for testing a plurality of singulated 3D-stacked chip cubes by utilizing adjustable wafer maps to adjust the pick-and-place positions of the cubes on a carrier wafer. In one embodiment an automotive interior component comprises an automotive instrument panel having an outer surface and an inner surface. The connectors are preferably adapted to produce an end-to-side anastomosis at a graftcoronary artery junction. The openings are at least large enough for a user to insert his thumb and a finger within the container to be able to withdraw a bag from within the container. The magnetic field distribution for the integrated circuit may be determined by using the above procedure on a grid like pattern above the IC. The portable power supply is used electrically power the light assembly and can be recharged through a universal serial bus charging port.