An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. The first component service, configured to generate a first result, may be deployed to a first service execution environment located at a device layer. When the solder cools, an improved solder bond is formed. It may be prepared into tasty dishes with the use of little or no additional fat. This abstract itself is not intended to limit the scope of this patent. Another inertia member 85B is attached to the output shaft 83a of the conveyor motor 83.