Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The recovery apparatus provides additional energy from the air passing the vehicle. A position sensor coupled to the laser material processing head measures the difference between the actual position of the workpiece and a predetermined theoretical position of the workpiece. The method is initiated by calling a web site from the caller node by utilizing communications link, which includes a browser for accessing the web site. A portion of the electrode-defining layer is between the extending portion and the III-N material structure.