A method of forming a MEMS device produces a device layer wafer having a pre-formed conductive pathway before coupling it with a handle wafer. The flexible pipe is formed by winding a metallic tubular member in a spiral shape in an overlapped manner, and a plurality of wavy corrugations are formed on the peripheral wall surface of the flexible pipe continuously in the axial direction. Content items are indexed and ranked indications of at least some indexed content items are output in response to search queries. Compartmentalization of the effort in developing and porting an application is facilitated for protection of source code and better management of designers and developers working on different aspects of a software application due to the externalization of the resource files needed primarily by the designers. The parameter of the wafer is determined from the determined difference in optical power. The indicating circuit is configured to detect an opening of the primary fuse element wherein a circuit path is broken through the primary fuse element.