A current sensor according to the present invention comprises a multilayer substrate comprising two or more layers, a through-hole provided to pierce the multilayer substrate from the front face to the rear face, a coil formed by connecting a wiring on the front face with a wiring on the rear face via the through-hole, and a wire pattern arranged so as to thread through the coil. Other systems, methods, and computer program products are described in additional embodiments. The apparatus also includes a rotating time of flight diffusion module and a non-rotating wall thickness module carried by the inspection unit. Preferably the resin particles have a glass transition temperature of not less than room temperature. A linear damper is operatively connected to the first linkage at a distance from the pivot point, such as by a second linkage or lever arm, and connected to the base for damping pivoting motion of the first linkage.