A laminated molded body is produced by coextrusion of plural types of resin materials and includes a main body and, superimposed on its surface, a decorative layer and a surface layer. The cooling system includes a recirculating loop that includes at least three heat exchangers in fluid communication with the recirculating loop. The case has a hole; the chassis, lying under the case, includes a latch and a set of slots. When mounting the semiconductor device, the common leads are bridged with brazing material. A threaded follower on the screw travels along the screw when it is rotated by the motor.