Methods for manufacturing thin film transistor arrays utilizing three steps of lithography and one step of laser ablation while the lithography procedure is used four to five times in conventional processes are disclosed. When the blow pin is no longer needed, it is retracted from the mold and a pinch plate assembly is used to close off the opening in the molded part created by the blow pin. per stretch of fencing between adjacent support posts to provide long term reliability. The top portion of this hole forms the microscopic aperture. The lower base part and the upper base part are at least partly made of plastics and are connected together by means of welding or bonding using an adhesive. The pad is further configured to contact an associated object to transfer the received ink to the associated object.