1461140313-e32ae04f-f2db-4071-a95f-6550b9301907

A plurality of content items are retrieved from multiple network sites. The present invention relates to an integrated circuit device having a Cu wiring layer, a barrier layer therefor and a dielectric layer, wherein the barrier layer is represented by a compositional formula of TaOxNy. Further, the present disclosure, in one aspect, relates to a laminated composite material, comprising a glass plate and a polyamide resin layer; the polyamide resin layer laminated onto one surface of the glass plate, the polyamide resin layer having yellowness of 2. These pairs of surrounding patterns with the different aperture rates change the influence of charge-up on the pattern to be determined. Resulting field emission cathodes exhibit better field emission characteristics because of the increased concentration of nitrogen within the film.