A device having arrays of semiconductor structures with dimensions, ordering and orientations to provide for light absorption and charge carrier separation. A slice flag is set to a first value for the first slice in the picture and corresponding slice flags of the remaining slices are set to a second defined value. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. The mold has first and second mold halves which are brought together to form the caps. Whereas, all parts are managed by one entity instead of several across various platforms and structures.