The present disclosure discloses a method of fabricating a semiconductor device. The cap ply is a leno weave tape having warp yarn in the longitudinal direction and weft yarns in the weft direction. The arms on a star are covalently attached to the core of the star; each arm comprises one or more polymer segments; and at least one arm andor at least one segment exhibits a different solubility from at least one other arm or one other segment, respectively, in a reference liquid of interest.