A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. In a first embodiment, first and second liquid crystal polymer dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. A low frequency line and a second decoupling filter are connected in series between an output terminal, through which a signal flows into a circuit, and a contact point between the first decoupling filter and the gas arrestor.