A weather strip assembly and application of same are provided. The die includes a circuit side having a pattern of die contacts, planarized wire bonding contacts bonded to the die contacts, and a planarized polymer layer on the circuit side configured as stress defect barrier. The reagent container includes a container body and a lid having a plurality of hollow piercing sections, formed on a lower surface of the lid, protruding downward for piercing the seal member at each of the openings, and openings, formed in an upper surface of the lid, communicating with piercing sections respectively to allow the probe to be inserted therethrough or withdrawn therefrom. Each blade includes a single radial point which a) lies on the circumference of the reference circle prior to movement of the blade, and b) may be moved only along a radius of the reference circle on movement of the blade. In one embodiment, the fixture is an anti-ligature dispenser with automatic dispensing means. A semiconductor chip of the semiconductor device has a core transistor region, an IO cell placement region and a pad placement region.