A high-pressure pad cleaning system that can be used in conjunction with semiconductor device fabrication tools that utilize pads, such as chemical-mechanical polishing tools, is disclosed. The polynomials each correspond to a given state of a pseudorandom sequence and derivation of a particular such polynomial will allow calculation of the corresponding given state. The hinge assembly permits opening of the housing while the cover piece and roll holding piece remain connected by the hinge assembly. The spring holder has spring support pieces on the outer periphery thereof to prevent radially outward movement of the elastic members.