A light reflected from a semiconductor die is used for enhanced control of substrate removal from the die. The method includes: a 3rd Generation Partnership Project network entity sending outer Internet Protocol packet header information to a Broadband Forum access network entity; and the BBF access network entity scheduling a data packet matching the outer IP packet header information according to a Differentiated Services Code Point of the data packet. Rearward protruding wiring flanges provides support for low voltage wires and cabling. A collimator constructed of a radiation attenuative material is arranged on the side of the detector facing the object. Further, a fibrous product is described incorporating encapsulated long persistent phosphor particles.