A method of generating a simulation model of a predefined fabrication process according to a sample conductive feature includes receiving a geometry configuration and layout design of the conductive feature. In preferred embodiments the images are acquired while maintaining motion of the samples. Further, the resin film is as the lowermost layer, the adhesive layer is provided thereon, and the paper or plastic film with the image receiving layer coat is provided thereon. The memory matrix also includes a third column line distinct from the first column line and from the second column line. A dielectric layer is formed on the base layer and on a second portion of the trench isolation region peripheral to the base layer. The frame also has a back panel which also may be adjusted between open and closed positions.